Where are Ebonsella's Headquarters?

Ebonsella's Headquarters are in 10636 Scripps Summit Court Suite 132,San Diego,California,United States

What is Ebonsella's phone number?

Ebonsella's phone number is +1 858-381-5188

What is Ebonsella's official website?

Ebonsella's official website is https://www.ebonsella.com

What is Ebonsella's NAICS code?

Ebonsella's NAICS code is 541330

What is Ebonsella's Industry?

Ebonsella is in the industry of Electrical/Electronic Manufacturing

Who is Ebonsella's Vice President Business Development?

Ebonsella's Vice President Business Development is John Adams

Ebonsella

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Description

We Provide Contract Engineering, Manufacturing + Fabrication Solutions. We are a Manufacturers Representative for Local + Global Technology Companies- PCB Fabrication, Injection Molding, Membranes, Silicone Key Pads, Cables, Contract Manufacturing and separately Provide Engineering , Fabrication & Manufacturing Services for Proto Typing, NPI Activities to Production.We allow Flexibility, Scalability for Companies to concentrate on their Core Technology and Business in an ever changing Global Environment. We support the Industries of Biotech, Life Science, Industrial, Semiconductor, Capital Equipment, High Tech,Wireless, Alternative Energy, Consumer Electronics, Military, Research and Development and Infrastructure.We offer complete design, engineering, and manufacturing services to aerospace, automotive, computing, consumer digital, industrial, infrastructure, medical and mobile OEM customers. We are on the West coast of the United States . We help our Local and Global customers design, build, ship, and service electronics products worldwide by combining the advantages of a vertically integrated service offering with the benefits of a global, low-cost manufacturing base. We enable customers to optimize supply chain operations, accelerate time to market and time to volume, and reduce capital investments and production costs.Chip On Board or COB, Chip On Flex or COF, Plated Thru Hole Technology or PTH and IC Assembly Ball Grid Array or BGA , micro Ball Grid Array or u BGAFlip Chip Attach or FCAWafer Thinning, Sawing, InspectionDie Attach by Epoxy or EutecticWire Bonding by Aluminum Wedge, Gold Wedge, Gold BallWire Bond Pull, Die Shear and Die EncapsulationCeramic Packages, Side Brazed, LCC, J-Bend, SOIC, PGA, Flat Pack, Cerquad, TO-Header, Cerdip, Leaded Chip Carrier,Turnkey and Consigned Assembly offering Design for Manufacturability or DFM , Material Logistics Low to High Volume24 Hour, 2-3 Days Quick Turn ServicesBGA, FPGA, Fine Pitch Components
Headquarters:10636 Scripps Summit Court Suite 132, San Diego, California, United States
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Phone Number: +1 858-381-5188
Website: https://www.ebonsella.com
Employees:6
Revenue:$0 - 1M
Legal Name:Ebonsella
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| NAICS Code: 541330 |
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Vice President Business Development for Ebonsella

John Adams

Vice President Business Development

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